Software Engineering Intern
JPMorgan Chase & Co.
Summer 2026
Upcoming
Computer Science and Engineering student at The Ohio State University focused on full-stack development and software engineering.
Selected experience
Highlights
Summer 2026
Incoming Software Engineering Intern at JPMorgan Chase
May 2027
Expected Ohio State graduation in Computer Science and Engineering
2x JPMC
Returning after a previous software engineering internship
Actions
Education
Education, coursework, and honors.
B.S. in Computer Science and Engineering
Columbus, OH
Expected May 2027
Concentration
Software Engineering
Relevant coursework
Software Development and Design, Data Structures and Algorithms, Algorithm Design and Analysis
Recognition
Experience
Product, platform, and full-stack engineering work across enterprise teams.
JPMorgan Chase & Co.
Summer 2026
Upcoming
JPMorgan Chase & Co.
Columbus, OH
June 2025 - July 2025
Amazon Devices
Seattle, WA
May 2024 - Aug 2024
Skills
Languages, frameworks, and tools.
Languages
Web
Cloud + DevOps
Testing + Workflow
Leadership
Programs and roles focused on leadership, communication, and execution.
CodePath Technical Interview Prep
Washington, DC
Feb 2025 - Present
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Washington, DC
Nov 2024 - Present
DEV at The Ohio State University
Columbus, OH
Aug 2023 - May 2024